Features and Strengths
- Features and Strengths
Are you facing issues relating to conductive pastes?
Kyoto Elex can help you resolve those issues.
Kyoto Elex continuously explores the possibilities of conductive pastes.
We freely create ideas starting with the mindset that we want to meet customer expectations to achieve products that are ideally suited to customer needs.
- Silver Paste
- Resin-type copper Paste
- Silver/Palladium Paste
- Copper Paste
- Silver/Platinum Paste
- Aluminium Paste
- Resin-type silver Paste
- Glass Paste
Conductive pastes can be created in endless quantities by combining metal powders with resins. There are various powder mixing ratios and shapes, powder processing methods, and techniques for mixing with diverse resins and solvents.
Kyoto Elex employs technological capabilities to integrate original organic and inorganic chemistry technologies and achieve the needed functions, ease of handling, durability, cost, and other features.
It is not always necessary to develop and customize new specifications in order to meet customer needs. It is also possible to achieve the needed performance through innovative methods of use.
Kyoto Elex has provided countless solutions to date and has diverse knowledge for finding solutions to problems. There is significance in the number of proposals made.
Kyoto Elex Case Studies
- The spark that triggered the proliferation of mobile phones
In 1996, mobile phones were launched with minimum weight and size of under 100 g and 100 cc. Cumulative sales exceed 400 million units, leading to explosive proliferation. Kyoto Elex made significant contributions to the creation of these mobile phones. Until then, mobile phones used through hole circuit boards with inter-layer connections formed by plating. The adoption of high-density, multi-layer circuit boards that use paste for inter-layer connections made miniaturization possible. The key to success was via paste. By developing a paste specially for use in via (holes), we helped to make it possible to create high-density, multi-layer circuit boards.
- Technology that outperforms that of well-known major makers
Kyoto Elex was a pioneer in Japan in creating conductive pastes that use copper instead of silver wiring on ceramic boards. When the company was established in 1986, highly conductive silver materials were used to connect circuit boards. However, the high cost of silver was a major issue. For this reason, we turned our attention to copper. The cost using of copper is just one-half to one-third that of silver, but copper has other issues including oxidation, high volume resistivity, and achieving long-term reliability. There was a number of problems that had to be resolved for commercial application, but Kyoto Elex’s parent companies are DKS Co. Ltd., which has strengths in resin materials and dispersal technologies, and DOWA Electronics Materials Co., Ltd., which has strengths in metal powders, enabling us to successfully develop a copper paste with characteristics equivalent to those of silver paste.
As copper paste attracted increasing attention, major companies outside of Japan were suspected of patent infringement. As it turned out, there was no patent infringement, and a third-party evaluation stating that Kyoto Elex was superior in terms of technology and performance was obtained. Kyoto Elex used this opportunity to open new paths for sintered conductive pastes.
- Fifteen years after success, our products become key components of electric vehicles
“We want to develop new products with certain characteristics. Can you create a paste that will do this?”—these are some of the various inquiries made to Kyoto Elex by engineers who are looking 10 and 20 years into the future and seek to create products based on new ideas. This project was one such instance.
The product was an electronic component, and although the ultimate applications were unknown at the time, the objectives were design innovations and thermal shock resistance at extremely high levels. Following a one-year period of trial and error, we created a conductive paste that achieved the objectives. Fifteen years later, the engineer’s dream was fulfilled with the creation of a product with a ceramic and resin hybrid electrode structure that can withstand temperatures up to 150° C. Today, these products are attracting attention as key components in electric vehicles.