Products and Solution Examples
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- Products and Solution Examples
Lineup of products with varied grades and specifications,
customized to match your uses and needs
The conductive pastes which are comprised metal or glass
powders with suitable shape or thickness to combine with resin
can be freely manipulated to meet your needs.
Product Types
Resin Curing Type Conductive Paste
- ScScreen printing
- DiDispense
- StStamping
- DpDipping
| Products | Applications | Features | Type | Curing Conditions |
Resistivity (Ω-cm) |
Application Methods |
| Wiring applications | ||||||
|---|---|---|---|---|---|---|
| DD-1630L-245 | Wiring on glass, Wiring on wafer | Low resistivity | Ag | 200°C-40 min. | 7×10-6 | Sc Di |
| DD-3800B-103 | Wiring on glass, Wiring on wafer | Low resistivity | Ag/Cu | 200°C-40 min. | 7×10-6 | Sc Di |
| DD-1630L-885 | Wiring on film | Low resistivity Low-temperature curing | Ag | 120°C-60 min. | 5×10-6 | Sc Di |
| DD-1630M-653 | Wiring on film | Flexibility Low-temperature curing | Ag | 100°C-60 min. | 1×10-4 | Sc Di |
| Adhesive applications | ||||||
| DD-1930L-133 | Die attachment, LEDs, etc. | Solvent free | Ag | 180°C-30 min. | 7×10-5 | Sc Di St |
| DD-1930L-173 | Die attachment, LEDs, etc. | Solvent free High thermal resistance | Ag | 180°C-30 min. | 3×10-4 | Sc Di St |
| DD-1930L-360 | Die attachment, Power ICs, etc. | High thermal conductivity | Ag | 200°C-40 min. | 8×10-6 | Sc Di St |
| DD-1960A-537 | Die attachment, Solder alternative | Low-temperature, rapid curing | Ag | 150°C-5 min. | 3×10-3 | Sc Di St |
| Electrode Applications for Electronic Component | ||||||
| DD-1820K-425 | Tantalum electrolytic capacitors, Element coating |
Low resistivity | Ag | 150°C-30 min. | 2×10-5 | Dp |
| DD-1790 | Aluminum electrolytic capacitors, Element coating |
Low resistivity | Ag | 200°C-40 min. | 1×10-5 | Sc Di |
| DD-3820G-510 | Tantalum/aluminum electrolytic capacitors, Lead frame attachment |
Low silver content Ag/Cu type | Ag/Cu | 200°C-40 min. | 5×10-5 | Sc Di |
| DD-1820X-580 | Tantalum/aluminum electrolysis capacitors, Lead frame attachment |
Low silver content Ag type | Ag | 200°C-40 min. | 3×10-4 | Sc Di |
| DD-1950A | MLCC/MLCI, Soft termination | Flexibility Shock resistance | Ag | 200°C-60 min. | 1×10-4 | Sc Dp |
| DD-1950B | Resistors, Plating base electrodes | Plating ability | Ag | 200°C-60 min. | 1×10-4 | Sc Dp |
| Solar Cell Applications | ||||||
| DD-1760L,F series | HJT electrodes | Low resistivity Solderability | Ag | 200°C-40 min. | Sc | |
| DD-1760M,Q series | HJT electrodes (finger) | Double printing Low resistivity | Ag | 200°C-40 min. | Sc | |
| DD-1760R series | HJT electrodes (tab electrodes) | Double printing Good solder wettability | Ag | 200°C-40 min. | Sc | |
| DD-1960A series | Conductive adhesive for shingling applications | Low-temperature, rapid curing Flexibility | Ag | 150°C-5 min. | Sc Di | |
| DD-1960S series | Conductive adhesive for stringing applications | Low-temperature, rapid curing High strength | Ag | 150°C-5 min. | Sc Di | |
| DD-1200C series | BSF surface electrodes | Ag | Sc | |||
Example of Product Characteristics
-
We are tackling the challenges of conductor products with low resistivity approaching that of silver and copper over a wide range of curing and sintering temperatures.
-
Resistance values that were previously possible only at 200°C have been achieved at 100°C, expanding the possibilities of wiring application on film substrates and more. We continue to tackle the challenges of low-temperature, rapid curing.
Sintered Conductive Paste
- ScScreen printing
- MeMetal mask printing
- DpDipping
| Products | Applications | Type | Sintering Conditions | Resistivity (mΩ/□/10µm) |
Adhesion Strength (N/2mm□) |
Application Methods |
|
| Electrode Applications for Electronic Component | |||||||
|---|---|---|---|---|---|---|---|
| DD-6810A-100 | Thermistors | Al | 750°C-7 min. | Air | ≦20 | ― | Sc |
| DD-1240 series | Piezoelectric elements, External electrodes |
Ag | 600~850°C | Air | ≦3 | ≧40 | Sc Dp |
| DD-1235 series | Inductors, External electrodes | Ag | 600~850°C | Air | ≦3 | ≧40 | Sc Dp |
| DD-1411F series | Inductors, Internal electrodes | Ag, AgPd | 600~850°C | Air | ≦3 | ― | Sc |
| DD-1375 series | Varistors, External electrodes | Ag/X | 600~850°C | Air | ≦3 | ≧40 | Sc Dp |
| DD-1204A-102 | Thermal heads, Electrodes | Ag | 810°C-7 min. | Air | ≦3 | ≧40 | Sc |
| DD-1411D | Glass, Electrodes | Ag | 500°C-10 min. | Air | ≦3 | ≧30 | Sc |
| DD-6820A-200 | Glass/quartz, Electrodes | Al | 600°C-10 min. | Air | ≦30 | ― | Sc |
| Green Sheet (co-sintering) Applications | |||||||
| DD-1411 series | Shrinkage type, Wiring | Ag,AgPd | 900°C | Air | ≦3 | ― | Sc |
| DD-1421 series | Shrinkage type, Via | Ag,AgPd | 900°C | Air | ≦3 | ― | Sc Me |
| DD-1400D-591 | Non-shrinkage type, Wiring | Ag,AgPd | 900°C | Air | ≦3 | ― | Sc |
| DD-1421B-302 | Non-shrinkage type, Via | Ag,AgPd | 900°C | Air | ≦3 | ― | Sc Me |
| Hybrid IC (post-sintering) Applications | |||||||
| DD-1240 series | Aluminum circuit boards | Ag | 850°C-7 min. | Air | ≦3 | ≧50(≧30) | Sc |
| DD-2300 series | Aluminum circuit boards | Ag/Pd | 850°C-7 min. | Air | 3 ~ 70 | ≧30(≧20) | Sc |
| DD-1130 series | Aluminum circuit boards | Ag/Pt | 850°C-7 min. | Air | ≦4 | ≧40(≧30) | Sc |
| DD-3780D series | Aluminum circuit boards | Cu | 900°C-10 min. | N2 | ≦3.5 | ≧40(≧30) | Sc |
| DD-3670D series | Aluminum circuit boards | Cu | 600°C-10 min. | N2 | ≦4 | ≧35(≧30) | Sc |
| DD-3780D series | Silicon nitride circuit boards | Cu | 850°C-7 min. | N2 | ≦5 | ≧30(≧20) | Sc |
| DD-2860 series | Aluminum nitride circuit boards | Ag/Pd | 850°C-7 min. | Air | 3 ~ 30 | ≧30(≧20) | Sc |
| DD-3850D series | Aluminum nitride circuit boards | Cu | 900°C-10 min. | N2 | ≦5 | ≧30(≧20) | Sc |
Example of Product Characteristics
-
We are reducing silver content by developing particles (including silver and silver-coated particles) in various shapes.
-
In response to the adoption of thin-film electronic components, Kyoto Elex is tackling better particle dispersion even though used ever smaller electrode particles (nanoparticles).
These are just examples. Please confer with us about any issues you may have.
Examples
-
Reducing resistivity
Reducing silver content (reducing relative density)
Increasing strength
Increasing flexibility
Increasing sulfidation resistance
-
Heat resistance
Moisture resistance
Noise control
Increasing thermal conduction
Increasing thermal shock resistance
-
Raising printing performance
Responses on the nano-level
Magnetic paste
Improving yields
Cost reduction
-
Low-temperature curing
Reducing coefficient of contraction
Compliance with environmental regulatory requirements
Rapid curing
