Introduction to New Products for China
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- Introduction to New Products for China
Meeting the Growing Needs of the Chinese Market
太阳能电池用高性能导电浆料事业于
中国国内设立制造基地
本公司至今已开发并制造了各类高性能导电浆料用于电子零部件或太阳能电池等。
其中，HJT型太阳能电池用导电浆料更是获得了广大客户的好评，并面向美国、欧洲、中国及东亚等太阳能电池厂家开展广泛的开发及销售业务。
其中，中国客户的增长尤其显著，为此本公司如今计划于中国国内开设制造基地。
预计明年我们将能够为客户提供于中国国内制造的高性能导电浆料，敬请期待。
New HJT Paste
Advanced low temperature paste for HJT solar cells
DD-1760 Series
我们的HJT银浆面向全球客户的需求
Our HJT paste targets worldwide customer requirements
开发路线图 Road Map
| Gen.1 | Gen.2 | Gen.3 | |||||
|---|---|---|---|---|---|---|---|
| Single print | Dual/Double print | Single print | Dual/Double print | ||||
| DD-1760L-359 | DD-1760Q-116 | DD-1760R-103 | DD-1760F-131 | DD-1760Q-132 | DD-1760R-104 | ||
| Remarks | Standard | Low resistivity | High peel strength | High-speed printing Fine line |
Low resistivity High-speed printing Fine line |
High peel strength Wide process window |
|
| Volume resistivity *1 | ×10-6Ω・cm | 5.0 ~ 7.0 | 4.5 ~ 5.5 | 7.0 ~ 9.0 | 4.5 ~ 6.5 | 4.0 ~ 5.0 | 7.0 ~ 9.0 |
| Tab peel strength *2 | N/mm | 0.5 ~ 1.0 | - | 1.0 ~ 2.0 | 0.5 ~ 1.0 | - | 1.5 ~ 2.5 |
| Printing speed | mm/s | 100 ~ 150 | 150 ~ 200 | 100 ~ 150 | 200 ~ 250 | 200 ~ 250 | 150～200 |
Application for Multi-busbar R-104
Wide process window
Suitable for various
solder compositions
High speed printing
Fine line printing
F-131/Q-132
Signlificantly Increased ine resistance
Saving silver paste usage
Q-132/R-104
L-359 Double print
Saving silver paste
L-359 Double print vs Q-132/R-104 Dual print
New DD-1960A Series
叠瓦用途的导电胶
Conductive paste for shingling application
DD-1960A Series
我们的产品在太阳能组件中表现出高性能
Our product provide high performance of Solar module
点胶特性Dispensing property
Jet Dispensing_φ200um
（DD-1960A-537 vs DD-1960A-877）
Improved continuous dispensing
（more than 4 times of our conventional product）
BiliBili
YouTube
印刷特性Printing property
Stencil printing_250um
（DD-1960A-537 vs DD-1960A-900）
Suppresses expansion after wafer stacking
Wafer stacking width can be reduced
① Module power output is improved by changing the module design.
② Saving silver paste usage.
Module power gain about 11W or 3.2% when the overlap width is suppressed by 50%
High Adhesive strength
（DD-1960A-537 vs DD-1960A-900）
Adhesive strength of 250um width comparable to conventional product of 500 um width
Wafer stacking width can be reduced
Reliability
DD-1960A-900 MiniModuleThermal cycles
-40°C/90°C, P-PERC, 3modules average
EL images
Characteristic features
| Product name | Application method |
Advantages | Silver content (%) |
Viscosity *1 (Pa・s) |
Volume resistivity *2 (120°C-10min)(Ω・cm) |
Adhesive strength *3 (120°C-10min)(MPa) |
Glass transition temperature(°C) |
E’-modulus at -50°C(MPa) |
E’-modulus at -25°C(MPa) |
|---|---|---|---|---|---|---|---|---|---|
| DD-1960A-537 | Jet Stencil Screen |
Conventional | 60〜64 | 20〜60 | 3×10-3 | 8 | 10 | 2200 | 40 |
| DD-1960A-877 | Jet | Good Dispensing property |
60〜64 | 30〜70 | 1×10-3 | 7 | -5 | 2000 | 5 |
| DD-1960A-900 | Stencil Screen |
Low bleeding, High Adhesive strength |
60〜64 | 20〜60 | 2×10-3 | 15 | 20 | 2200 | 110 |
*1 Toki Sangyo TVE-35H viscometer, 1rpm, 25°C *2 Screen printing on alumina substrates and cured at curing process *3 Al/conductive paste/alumina substrate
问卷调查 / 在线技术咨询
请回答关于新产品的问卷调查。
此外，还可通过在线通话进行技术咨询，如需使用敬请随时告知。
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